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Evaluation of tensile stress-strain curve of electroplated copper film by characterizing indentation size effect with a single nanoindentation
Kim, Si-Hoon, Kim, Young-Cheon, Lee, Sukbin, Kim, Ju-YoungVolume:
23
Language:
english
Journal:
Metals and Materials International
DOI:
10.1007/s12540-017-6461-y
Date:
January, 2017
File:
PDF, 1.49 MB
english, 2017