Early stages of localized recrystallization in Pb-free BGA...

Journal of Alloys and Compounds 2017 / 05 Vol. 704

Early stages of localized recrystallization in Pb-free BGA solder joints subjected to thermomechanical stress

Han, J., Guo, F., Liu, J.P.
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Volume:
704
Language:
english
Journal:
Journal of Alloys and Compounds
DOI:
10.1016/j.jallcom.2017.02.090
Date:
May, 2017
File:
PDF, 1.72 MB
english, 2017
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