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Creep Constitutive Models Suitable for Solder Alloys in Electronic Assemblies
Mukherjee, Subhasis, Nuhi, Mohammed, Dasgupta, Abhijit, Modarres, MohammadVolume:
138
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.4033375
Date:
June, 2016
File:
PDF, 857 KB
english, 2016