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[ASME ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Burlingame, California, USA (Tuesday 16 July 2013)] Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems - Combining Computational Fluid Dynamics (CFD) and Flow Network Modeling (FNM) for Design of a Multi-Chip Module (MCM) Cold Plate
Fernandes, John, Ghalambor, Saeed, Docca, Akhil, Aldham, Chris, Agonafer, Dereje, Chenelly, Evan, Chan, Benson, Ellsworth, MichaelYear:
2013
Language:
english
DOI:
10.1115/ipack2013-73294
File:
PDF, 1.41 MB
english, 2013