Integrating CoNi nanoparticles encapsulated by few-layer h...

Journal of Alloys and Compounds 2017 / 05 Vol. 704

Integrating CoNi nanoparticles encapsulated by few-layer h -BN with excellent thermal conductivity and thermal stability

Fan, Dongliang, Lv, Xiaomeng, Feng, Jin, Zhang, Suyun, Xie, Jimin, Liu, Jun
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Volume:
704
Language:
english
Journal:
Journal of Alloys and Compounds
DOI:
10.1016/j.jallcom.2017.02.093
Date:
May, 2017
File:
PDF, 6.94 MB
english, 2017
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