Humidity Buildup in Electronic Enclosures Exposed to...

IEEE Transactions on Components Packaging and Manufacturing Technology 2017 / 3 Vol. 7; Iss. 3

Humidity Buildup in Electronic Enclosures Exposed to Constant Conditions

Conseil-Gudla, H., Staliulionis, Z., Jellesen, M. S., Jabbari, M., Hattel, J. H., Ambat, R.
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Volume:
7
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2017.2655447
Date:
March, 2017
File:
PDF, 2.60 MB
english, 2017
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