Durability of Low Melt Alloys as Thermal Interface Materials
Roy, Chandan K., Bhavnani, Sushil, Hamilton, Michael C., Wayne Johnson, R., Knight, Roy W., Harris, Daniel K.Volume:
138
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.4032462
Date:
March, 2016
File:
PDF, 1.51 MB
english, 2016