Durability of Low Melt Alloys as Thermal Interface...

Durability of Low Melt Alloys as Thermal Interface Materials

Roy, Chandan K., Bhavnani, Sushil, Hamilton, Michael C., Wayne Johnson, R., Knight, Roy W., Harris, Daniel K.
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Volume:
138
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.4032462
Date:
March, 2016
File:
PDF, 1.51 MB
english, 2016
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