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[ASME ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference - San Francisco, California, USA (July 17–22, 2005)] Advances in Electronic Packaging, Parts A, B, and C - Thermal Resistance and Pressure Drop of Silicon Based Micro Pin Fin Heat Exchanger Under Cross Flow
Prasher, Ravi S., Dirner, John, Chang, Je-Young, Myers, Alan, Chau, David, He, Dongming, Prstic, SuzanaYear:
2005
Language:
english
DOI:
10.1115/ipack2005-73086
File:
PDF, 1.01 MB
english, 2005