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Effect of Bond Layer Properties to Thermo-Mechanical Stresses in Flip Chip Packaging
Pok, Y.W., Sujan, D., Rahman, M.E., Dol, S.S., Yuan, H.L., Agarwal, R.K., Tandon, P., Wang, E.X.Volume:
95
Year:
2017
Language:
english
Journal:
MATEC Web of Conferences
DOI:
10.1051/matecconf/20179501003
File:
PDF, 336 KB
english, 2017