Study of Bend Discontinuities in Substrate Integrated Gap...

IEEE Microwave and Wireless Components Letters 2017 / 3 Vol. 27; Iss. 3

Study of Bend Discontinuities in Substrate Integrated Gap Waveguide

Zhang, Jing, Zhang, Xiupu, Kishk, Ahmed A.
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Volume:
27
Language:
english
Journal:
IEEE Microwave and Wireless Components Letters
DOI:
10.1109/LMWC.2017.2661707
Date:
March, 2017
File:
PDF, 963 KB
english, 2017
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