A Technique for Deducing In-Plane Modulus and Coefficient of Thermal Expansion of a Supported Thin Film
Chiang, Martin Y. M., Chiang, Chwan K., Wu, Wen-liVolume:
124
Year:
2002
Language:
english
Journal:
Journal of Engineering Materials and Technology
DOI:
10.1115/1.1448522
File:
PDF, 163 KB
english, 2002