[ASME ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Burlingame, California, USA (Tuesday 16 July 2013)] Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems - Impact of Material Properties on Cooling COP of Integrated Thermoelectric Microcoolers
Koh, Yee Rui, Yazawa, Kazuaki, Shakouri, AliYear:
2013
Language:
english
DOI:
10.1115/IPACK2013-73184
File:
PDF, 1.67 MB
english, 2013