Interface bond relaxation on the thermal conductivity of Si/Ge core-shell nanowires
Chen, Weifeng, He, Yan, Sun, Changqing, Ouyang, GangVolume:
6
Language:
english
Journal:
AIP Advances
DOI:
10.1063/1.4940768
Date:
January, 2016
File:
PDF, 745 KB
english, 2016