Plastic Encapsulated Microelectronics; Materials,...

Journal of Electronic Packaging 1997 Vol. 119; Iss. 2

Plastic Encapsulated Microelectronics; Materials, Processes, Quality, Reliability, and Application

Pecht, Michael G., Nguyen, Luu T., Hakim, Edward B., Rafanelli, Anthony J.
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Volume:
119
Year:
1997
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.2792221
File:
PDF, 299 KB
english, 1997
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