Joule heating induced thermomigration failure in un-powered microbumps due to thermal crosstalk in 2.5D IC technology
Li, Menglu, Kim, Dong Wook, Gu, Sam, Parkinson, Dilworth Y., Barnard, Harold, Tu, K. N.Volume:
120
Language:
english
Journal:
Journal of Applied Physics
DOI:
10.1063/1.4961219
Date:
August, 2016
File:
PDF, 4.13 MB
english, 2016