Evolution of microstructure and mechanical properties of...

Journal of Alloys and Compounds 2017 / 05 Vol. 705

Evolution of microstructure and mechanical properties of Cu/SAC305/Cu solder joints under the influence of low ultrasonic power

Tan, Ai Ting, Tan, Ai Wen, Yusof, Farazila
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Volume:
705
Language:
english
Journal:
Journal of Alloys and Compounds
DOI:
10.1016/j.jallcom.2017.02.165
Date:
May, 2017
File:
PDF, 12.64 MB
english, 2017
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