[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Next Generation Panel-Scale RDL with Ultra Small Photo Vias and Ultra-Fine Embedded Trenches for Low Cost 2.5D Interposers and High Density Fan-Out WLPs
Liu, Fuhan, Kubo, Atsushi, Nair, Chandrasekharan, Ando, Tomoyuki, Furuya, Ryuta, Dwarakanath, Shreya, Sundaram, Venky, Tummala, Rao R.Year:
2016
Language:
english
DOI:
10.1109/ectc.2016.313
File:
PDF, 567 KB
english, 2016