Thermal Analysis of Air-Cooled Electronic Units With Integrated Offset Strip-Fin Heat Sink
Sundén, Bengt, Xie, GongnanVolume:
136
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.4026538
Date:
April, 2014
File:
PDF, 1.02 MB
english, 2014