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[ASME ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference - San Francisco, California, USA (July 17–22, 2005)] Advances in Electronic Packaging, Parts A, B, and C - Thermal and Mechanical Properties of Silicone Thermal Interface Materials With Varying Cross-Link Densities
Gowda, Arun, Zhong, Annita, Tonapi, Sandeep, Nagarkar, Kaustubh, Srihari, K.Year:
2005
Language:
english
DOI:
10.1115/IPACK2005-73490
File:
PDF, 440 KB
english, 2005