[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Moisture Diffusion and Hygroscopic Swelling of Adhesives in Electronics Packaging
Liu, Ruiyang, Wang, Huayan, Wang, Jing, Lee, Hohyung, Park, S. B., Xue, Xiaojie, Kim, Yeonsung, Saiyed, Shafi, Sengupta, DipakYear:
2016
Language:
english
DOI:
10.1109/ectc.2016.385
File:
PDF, 2.16 MB
english, 2016