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Humidity Build-Up in a Typical Electronic Enclosure Exposed to Cycling Conditions and Effect on Corrosion Reliability
Conseil, Helene, Gudla, Visweswara Chakravarthy, Jellesen, Morten Stendahl, Ambat, RajanVolume:
6
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/tcpmt.2016.2590779
Date:
September, 2016
File:
PDF, 3.06 MB
english, 2016