Effect of Underfill Thermomechanical Properties on Thermal Cycling Fatigue Reliability of Flip-Chip Ball Grid Array
Wang, Tong Hong, Lai, Yi-Shao, Wu, Jenq-DahVolume:
126
Year:
2004
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.1827271
File:
PDF, 881 KB
english, 2004