Bimodularity of interface layer and curing stress coupling...

Bimodularity of interface layer and curing stress coupling effects on mixed mode fracture behaviour of functionally graded tee joint

Shah, Saumya, Panda, S.K.
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Volume:
75
Language:
english
Journal:
International Journal of Adhesion and Adhesives
DOI:
10.1016/j.ijadhadh.2017.02.016
Date:
June, 2017
File:
PDF, 1.29 MB
english, 2017
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