Bimodularity of interface layer and curing stress coupling effects on mixed mode fracture behaviour of functionally graded tee joint
Shah, Saumya, Panda, S.K.Volume:
75
Language:
english
Journal:
International Journal of Adhesion and Adhesives
DOI:
10.1016/j.ijadhadh.2017.02.016
Date:
June, 2017
File:
PDF, 1.29 MB
english, 2017