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[IEEE 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2016.11.30-2016.12.3)] 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) - High temperature endurable hermetic sealing material selection and reliability comparison for IR gas sensor module packaging
Au, K. Y., Zhi, Ding Mian, Chidambaram, Vivek, Lin, Bu, Piotr, Kropelnicki, KaiLiang, ChuanYear:
2016
Language:
english
DOI:
10.1109/EPTC.2016.7861430
File:
PDF, 852 KB
english, 2016