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[IEEE 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2016.11.30-2016.12.3)] 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) - Double-side direct contact calibration thru kit with non-exchanging structure
Chou, Wen, Chen, Bo-You, Wu, Sung-Mao, Chen, Cheng-Chang, Lin, Ming-ShanYear:
2016
DOI:
10.1109/EPTC.2016.7861440
File:
PDF, 369 KB
2016