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[IEEE 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2016.11.30-2016.12.3)] 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) - Qualification of 3D integrated silicon photonics
Fere, Massimo, Gobbato, Livio, Tremolada, Matteo, Shaw, Mark, Kermarrec, Olivier, Besset, Carine, Curti, Roberto, Fiabane, Fabio Pietro, Zhang, XuerenYear:
2016
Language:
english
DOI:
10.1109/EPTC.2016.7861446
File:
PDF, 674 KB
english, 2016