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[IEEE 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2016.11.30-2016.12.3)] 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) - Basics of thermosonic bonding of fine alloyed Ag wires
Murali, Sarangapani, Senthilkumar, B., Keong, Loke Chee, Theint, Ei Phyu Phyu, Kang, I TYear:
2016
DOI:
10.1109/EPTC.2016.7861478
File:
PDF, 424 KB
2016