[IEEE 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2016.11.30-2016.12.3)] 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) - Analysis of crack and dislocation of direct wafer bonded silicon diaphragm
Khoong, Ling Eng, Gan, Tai KweeYear:
2016
Language:
english
DOI:
10.1109/EPTC.2016.7861487
File:
PDF, 1.94 MB
english, 2016