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[IEEE 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2016.11.30-2016.12.3)] 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) - Investigation of residual stress effect during the anodic bonding process with different bondable materials for wafer level packaging design
Hu, Xiaodong, Meng, Maozhou, Baeuscher, Manuel, Hansen, Ulli, Maus, Simon, Gyenge, Oliver, Mackowiak, Piotr, Mukhopadhyay, Biswajit, Vokmer, N., Ehrmann, Oswin, Dieter Lang, Klaus, Ngo, Ha-DuongYear:
2016
Language:
english
DOI:
10.1109/EPTC.2016.7861498
File:
PDF, 939 KB
english, 2016