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[IEEE 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2016.11.30-2016.12.3)] 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) - Design and optimization of molding process for MEMS WLSCP
Lin, Bu, Zhi, Ding Mian, Peng, Ding Zhi, Kee, Peter Chang Hyun, Chen, Zhaohui, Jung, Boo YangYear:
2016
DOI:
10.1109/EPTC.2016.7861507
File:
PDF, 1.01 MB
2016