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[IEEE 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2016.11.30-2016.12.3)] 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) - TAIKO wafer ball attach
Schroder, Saskia, Schroder, Markus, Reinert, Wolfgang, Priewasser, Karl HeinzYear:
2016
DOI:
10.1109/EPTC.2016.7861519
File:
PDF, 418 KB
2016