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[IEEE 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2016.11.30-2016.12.3)] 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) - MEMS WLCSP development using vertical interconnection
Jung, Boo Yang, Zhaohui, Chen, Lin, Bu, Zhi, Ding Mian, Peng, Ding Zhi, Chong, Chai TaiYear:
2016
DOI:
10.1109/EPTC.2016.7861520
File:
PDF, 447 KB
2016