[IEEE 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2016.11.30-2016.12.3)] 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) - Influence of sintering conditions on mechanical properties of Ag-nano sintered material
Okuno, Shota, Yu, Qiang, Nakata, YusukeYear:
2016
DOI:
10.1109/EPTC.2016.7861526
File:
PDF, 547 KB
2016