[IEEE 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2016.11.30-2016.12.3)] 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) - Characterization of anodic bondable LTCC for wafer-level packaging
Hu, Xiaodong, Bauscher, Manuel, Mackowiak, Piotr, Zhang, Yucheng, Hoelck, Ole, Walter, Hans, Ihle, Martin, Ziesche, Steffen, Hansen, Ulli, Maus, Simon, Gyenge, Oliver, Mukhopadhyay, Biswajit, Ehrmann,Year:
2016
Language:
english
DOI:
10.1109/EPTC.2016.7861529
File:
PDF, 965 KB
english, 2016