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[IEEE 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2016.11.30-2016.12.3)] 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) - Overlay performance of through Si via last lithography for 3D packaging
Flack, Warren W., Hsieh, Robert, Kenyon, Gareth, Slabbekoorn, John, Czarnecki, Piotr, Tobback, Bert, Van Huylenbroeck, Stefaan, Stucchi, Michele, Vandeweyer, Tom, Miller, AndyYear:
2016
Language:
english
DOI:
10.1109/EPTC.2016.7861543
File:
PDF, 514 KB
english, 2016