![](/img/cover-not-exists.png)
[IEEE 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2016.11.30-2016.12.3)] 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) - Double side sintered IGBT 650V/ 200A in a TO-247 package for extreme performance and reliability
Greca, Gustavo, Salerno, Paul, Durham, Jeffrey, Le Henaff, Francois, Harel, Jean Claude, Hamelink, Johan, He, WeikunYear:
2016
DOI:
10.1109/EPTC.2016.7861548
File:
PDF, 335 KB
2016