[IEEE 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2016.11.30-2016.12.3)] 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) - Test method to evaluate a robust ball grid array (BGA) ball mount flux
Chou, Sheng-Hung, Liu, Yan, Durham, Maria, Lim, Sze Pei, Fang, Te-Hua, Hsiao, Yu-JenYear:
2016
DOI:
10.1109/EPTC.2016.7861555
File:
PDF, 447 KB
2016