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[IEEE 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2016.11.30-2016.12.3)] 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) - Evaluation on multiple layer PBO-based Cu RDL process for Fan-Out Wafer Level Packaging (FOWLP)
Boon, Soh Siew, Chui, K. J., David Ho, S. W., Sek, S. A., Yu, Mingbin, Lianto, Prayudi, Gu, Yu, See, Guan Huei, Bernt, Marvin L.Year:
2016
DOI:
10.1109/EPTC.2016.7861563
File:
PDF, 433 KB
2016