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[IEEE 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2016.11.30-2016.12.3)] 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) - Plasma etching of SiO2 with tapered sidewall for thin film encapsulation
Bliznetsov, Vladimir, Li, Bin, Lee, Jae-Wung, Lin, HuamaoYear:
2016
Language:
english
DOI:
10.1109/EPTC.2016.7861569
File:
PDF, 1.66 MB
english, 2016