![](/img/cover-not-exists.png)
[IEEE 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2016.11.30-2016.12.3)] 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) - Isolate micro-bump process development and improvement
Li, H. Y., Wing, Leong Yew, Gilho, Hwang, Piau, Chong Kok, Jaafar, Norhanani Binte, Chungpaiboonpatana, SurasitYear:
2016
DOI:
10.1109/EPTC.2016.7861581
File:
PDF, 623 KB
2016