[ASME ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels - San Francisco, California, USA (Monday 6 July 2015)] Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales - Tailoring of Permeability in Copper Inverse Opal for Electronic Cooling Applications
Zhang, Chi, Rong, Guoguang, Palko, James W., Dusseault, Thomas J., Asheghi, Mehdi, Santiago, Juan G., Goodson, Kenneth E.Year:
2015
Language:
english
DOI:
10.1115/IPACK2015-48262
File:
PDF, 3.24 MB
english, 2015