Laser cutting sandwich structure glass–silicon–glass wafer...

Optics & Laser Technology 2017 / 08 Vol. 93

Laser cutting sandwich structure glass–silicon–glass wafer with laser induced thermal–crack propagation

Cai, Yecheng, Wang, Maolu, Zhang, Hongzhi, Yang, Lijun, Fu, Xihong, Wang, Yang
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Volume:
93
Language:
english
Journal:
Optics & Laser Technology
DOI:
10.1016/j.optlastec.2017.01.028
Date:
August, 2017
File:
PDF, 5.75 MB
english, 2017
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