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Investigation on Thermal Characterization of Eutectic Flip-Chip UV-LEDs With Different Bonding Voidage
Liang, Renli, Zhang, Jun, Wang, Shuai, Chen, Qian, Xu, Linlin, Dai, Jiangnan, Chen, ChangqingVolume:
64
Language:
english
Journal:
IEEE Transactions on Electron Devices
DOI:
10.1109/ted.2017.2656240
Date:
March, 2017
File:
PDF, 2.06 MB
english, 2017