Enhanced Cooling of Electronic Components Using Fluid Flow...

Journal of Thermal Science and Engineering Applications 2015 / 09 Vol. 7; Iss. 3

Enhanced Cooling of Electronic Components Using Fluid Flow Under High Adverse Pressure Gradient

Ravishankar, S., Arul Prakash, K.
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Volume:
7
Language:
english
Journal:
Journal of Thermal Science and Engineering Applications
DOI:
10.1115/1.4026004
Date:
September, 2015
File:
PDF, 3.51 MB
english, 2015
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