Manufacturable Low-Cost Flip-Chip Mounting Technology for...

IEEE Transactions on Components Packaging and Manufacturing Technology 2017 / 4 Vol. 7; Iss. 4

Manufacturable Low-Cost Flip-Chip Mounting Technology for 300–500-GHz Assemblies

Weimann, Nils G., Monayakul, Sirinpa, Sinha, Siddhartha, Schmuckle, Franz-Josef, Hrobak, Michael, Stoppel, Dimitri, John, Wilfred, Kruger, Olaf, Doerner, Ralf, Janke, Bernd, Krozer, Viktor, Heinrich,
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Volume:
7
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2016.2636444
Date:
April, 2017
File:
PDF, 4.79 MB
english, 2017
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