[ASME ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels - San Francisco, California, USA (Monday 6 July 2015)] Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays - Modeling and Simulation Challenges in Embedded Two Phase Cooling: DARPA’s ICECool Program
Matin, Kaiser, Bar-Cohen, Avram, Maurer, Joseph J.Year:
2015
Language:
english
DOI:
10.1115/IPACK2015-48334
File:
PDF, 2.76 MB
english, 2015