Singularities at Solder Joint Interfaces and Their Effects...

Journal of Electronic Packaging 2010 Vol. 132; Iss. 2

Singularities at Solder Joint Interfaces and Their Effects on Fracture Models

Bhate, D., Chan, D., Subbarayan, G., Nguyen, L., Zhao, J., Edwards, D.
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Volume:
132
Year:
2010
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.4001588
File:
PDF, 1.43 MB
english, 2010
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