On the metallic bonding of GaN-based vertical...

Materials Science in Semiconductor Processing 2017 / 06 Vol. 63

On the metallic bonding of GaN-based vertical light-emitting diode

Khan, M.A., Trimby, P.W., Liu, H.W., Zheng, R.K.
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Volume:
63
Language:
english
Journal:
Materials Science in Semiconductor Processing
DOI:
10.1016/j.mssp.2017.02.025
Date:
June, 2017
File:
PDF, 1.48 MB
english, 2017
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