[IEEE 2016 IEEE/MTT-S International Microwave Symposium (IMS) - San Francisco, CA (2016.5.22-2016.5.27)] 2016 IEEE MTT-S International Microwave Symposium (IMS) - Investigation of TSV noise coupling in 3D-ICs using an experimental validated 3D TSV circuit model including Si substrate effects and TSV capacitance inversion behavior after wafer thinning

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