[ASME ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference - San Francisco, California, USA (July 17–22, 2005)] Advances in Electronic Packaging, Parts A, B, and C - Determination of the Anand Viscoplasticity Model Constants for SnAgCu
Rodgers, Bryan, Flood, Ben, Punch, Jeff, Waldron, FinbarrYear:
2005
Language:
english
DOI:
10.1115/ipack2005-73352
File:
PDF, 285 KB
english, 2005